一、The core advantages
★ The use of automatic solid crystal machine solid crystal, from process equipment to ensure accuracy, reliability of chip package.
★ The use of screw type dispenser, and fully guarantee the uniformity of solder paste and glue amount, enhance the uniformity of the thickness of the welding tin tin thickness and.
★ The use of low stress melting type epoxy resin packaging, ensure the product structure has a smaller package stress, improve the reliability of the device.
三、The product catalog